Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures

Abstract

There have been long-standing concerns about the stability of the internal structure of nanocrystalline metals. In this letter we examine grain growth in nanocrystalline Cu under the microhardness indenter, examining the influence of temperature of indentation and sample purity. Surprisingly, it is found that grain coarsening is even faster at cryogenic temperatures than at room temperature. Sample purity is seen to play an important role in determining the rate of grain growth. Fast grain coarsening can affect the outcome of mechanical tests, especially if they involve large stresses and high-purity samples.