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Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration

Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringMicrostructural AnalysisCorrosionPhysic Of FailureAverage Failure TimeElectronic PackagingMicrostructureSn-ag-bi-in Solder