The DOFLM Microelectronics Program

Abstract

A program on microelectronics (electronic microminiaturization) has been underway for the past two years at the Diamond Ordnance Fuze Laboratories (DOFL). Fourteen-component-part, transistorized binary counters were fabricated on 1/2-inch squares of steatite ceramic, 1/50 inch in thickness; and 5-part NOR's, on 1/2-inch squares of the same thickness. The techniques that have proved most useful in the program have been 1) photolithographic procedures for the accurate placement at microscopic dimensions of physical masks and electrical insulation, 2) thin film deposition using vacuum, chemical, and screening methods, 3) the use of a conductive adhesive which yields high strength and low resistivity connections, and 4) ultrasonic drilling and air abrasion enabling substrates and devices to be formed to desired sizes and shapes. Concurrent with the physical fabrication, studies were made of detailed circuit design and system applications. Future work will include 1) refinement of the present techniques to achieve inexpensive, reliable circuit wafers capable of mass production by industry, and 2) development of advanced methods more fully utilizing thin film deposition and diffusion techniques.