Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition - Concepedia

Concepedia

Publication | Closed Access

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

22

Citations

43

References

2011

Year

Wenhui Zhu, Edith S. W. Poh, X. R. Zhang, Xiaowu Zhang, T.C. Chai, Shujun Gao

Journal of Electronic Materials

Materials ScienceMaterials EngineeringEngineeringSuperalloyCorrosionApplied PhysicsMetallurgical InteractionAlloy DesignNi AdditionMicrostructure

References

	Year	Citations

Page 1