Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance - Concepedia

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Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance

39

Citations

15

References

2006

Year

Hongqin Wang, Feng Gao, Xin Ma, Yiyu Qian

Scripta Materialia

Materials EngineeringMaterials ScienceChemical EngineeringEngineeringCorrosionSurface ScienceWettingMetallurgical ProcessSurface TreatmentReactive WettingSurface Processing

References

	Year	Citations

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