Publication | Closed Access
Design for reliability of multi-layer stretchable interconnects
21
Citations
5
References
2014
Year
EngineeringMechanical EngineeringElectrical PerformanceInterconnect (Integrated Circuits)Reliability EngineeringAdvanced Packaging (Semiconductors)Electronic PackagingNumerical SimulationsMulti-layer Stretchable InterconnectsElectrical EngineeringElectromigration TechniqueHardware ReliabilitySolid MechanicsPlasticityDevice ReliabilityMicroelectronicsLow-cycle FatigueFlexible ElectronicsBi-layer DesignMechanics Of MaterialsElectrical Insulation
In this investigation, the electrical performance and reliability of multi-layer stretchable metal interconnects are evaluated using numerical simulations and experimental analysis. The numerical results show that the bi-layer design of stretchable interconnects have similar mechanics when compared to single layer interconnect structures. In contrast, interconnects configured in an in-plane stacked arrangement exhibit increased equivalent plastic strain during elongation, and consequently support less stretching. Our experimental results support these numerical findings. Maximum stretchability approaches ~150% elongation for single layer and bi-layer interconnects. In addition, fatigue experiments at 60% elongation show that the bi-layer design of stretchable interconnects have life cycles three orders of magnitude higher than the in-plane stacked arrangement of stretchable interconnects.
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