Filling porous silicon pores with poly(p phenylene vinylene)

Abstract

We have investigated hybrid organic-inorganic systems composed of silicon–porous silicon and poly(phenylene vinylene) (PPV) in order to fabricate new light emitting devices, having properties of both materials. The key concern in these systems is the control of the penetration of the polymer into the pores of the semiconductor to obtain the best contact between the materials. By optimizing the deposition parameters, we have successfully filled the porous silicon wafers with PPV as proved by microscopy and Raman analysis of the sample cross section. We have also shown that the contact between the silicon pores and the polymer did not change the structure of both materials.