Applied Physics Letters · 2002 · 17 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceFinite Element AnalysisHeat TransferThermal AnalysisHeat Transfer AnalysisHeat Transfer ModelingThermal DesignThermal Properties Of MaterialsThermal StressesThermomechanical AnalysisFinite Element Thermal AnalysisFinite Element Thermal ModelingPrinted Circuit BoardsThermal DeformationThermal Properties Of Printed PartsThermo-mechanical StressThermomechanical StressWarpage
Thermal deformations in printed circuit boards (PCB) were reduced by using wavy rather than straight electric lines or traces. The traces had either in-plane or out-of-plane waviness. Thermal deformations of a few different models were calculated using the finite element (FE) method. Periodic unit cell FE models were developed, and subjected to temperature changes. In-plane trace waviness was seen to reduce the thermal warpage of the PCB by ∼40%. Out-of-plane waviness also reduced the warpage, but to a lesser extent.
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Composite materials: testing and design
Composites · 1973 · 530 citations
Natural Sciences, Materials Engineering, Materials Science +12