A liquid cooling solution for temperature redistribution in 3D IC architectures

High-performance heat sinking for VLSI

David B. Tuckerman, R. F. W. Pease · IEEE Electron Device Letters · 1981 · 5.2K citations

Engineering, Computer Engineering, Electrical Engineering +17

Pumping liquids using asymmetric electrode arrays

Armand Ajdari · Physical review. E, Statistical physics, plasmas, fluids, and related interdisciplinary topics · 2000 · 437 citations

Engineering, Mechanical Engineering, Fluid Dynamics +16

Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements

Hendrik F. Hamann, Alan J. Weger, J. A. Lacey et al. · IEEE Journal of Solid-State Circuits · 2007 · 235 citations

Engineering, Computer Engineering, Computer Science +16

Advances in mesoscale thermal management technologies for microelectronics

Suresh V. Garimella · Microelectronics Journal · 2005 · 208 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Fast ac electro-osmotic micropumps with nonplanar electrodes

John Paul Urbanski, Todd Thorsen, Jeremy A. Levitan et al. · Applied Physics Letters · 2006 · 202 citations

Engineering, Electrical Engineering, Mechanical Engineering +16