A 195-Gb/s 1.2-W Inductive Inter-Chip Wireless Superconnect With Transmit Power Control Scheme for 3-D-Stacked System in a Package

Abstract

A wireless interface by inductive coupling achieves aggregated data rate of 195 Gb/s with power dissipation of 1.2W among 4-stacked chips in a package where 195 transceivers with the data rate of 1 Gb/s/channel are arranged in 50-/spl mu/m pitch in 0.25-/spl mu/m CMOS technology. By thinning chip thickness to 10/spl mu/m, the interface communicates at distance of 15 /spl mu/m at minimum and 43 /spl mu/m at maximum. A low-power single-end transmitter achieves 55% power reduction for multiple connections. The transmit power is dynamically controlled in accordance with communication distance to reduce not only power dissipation but also crosstalk.