Publication | Closed Access
Effects of moisture on properties of epoxy molding compounds
63
Citations
10
References
2001
Year
Materials ScienceMold ControlChemical EngineeringNovel EpoxyEngineeringThermal Degradation BehaviorDesiccationPolymer StabilityFunctional PropertyPolymer ScienceVitrificationPolymer ProcessingEpoxy Molding CompoundsPlastic DegradationThermoplastic CompositeThermal DegradationMolding (Process)Hydrothermal Processing
Abstract In this article the effects of moisture on a novel epoxy molding compound, including the mechanical properties, temperature transition, and thermal degradation behavior, are studied. The experimental results reveal that the absorbed water acts predominantly as a crazing agent, continuously decreasing the mechanical strength with the time in water. The glass‐transition temperature decreases at the early stage and is finally equilibrated. The thermal degradation behavior of the materials is not greatly influenced by the hydrothermal age. The decomposition of samples in oxygen is composed of two independent steps: the thermal degradation and oxidation at high temperature. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2253–2259, 2001
| Year | Citations | |
|---|---|---|
Page 1
Page 1