Vertically Integrated Electronic Circuits via a Combination of Self-Assembled Polyelectrolytes, Ink-Jet Printing, and Electroless Metal Plating Processes

Abstract

The advantages of polymers are the fabrication and patterning of ultra-large-area coatings. In this paper, an approach which combines self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating technologies for the fabrication of vertically integrated electronic circuits is successfully demonstrated. Through these processes, several layers of metal integrated circuits were deposited sequentially with polymer layers sandwiched between each layer of wires. Hence, one can build vertically integrated electronic components consisting of diodes, capacitors, resistors, and inductors with a relatively simple and low-cost technology.