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High-<i>k</i> GaAs metal insulator semiconductor capacitors passivated by <i>ex-situ</i> plasma-enhanced atomic layer deposited AlN for Fermi-level unpinning
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Citations
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References
2012
Year
SemiconductorsAluminium NitrideElectrical EngineeringSemiconductor TechnologyEngineeringNanoelectronicsSurface ScienceApplied PhysicsMis CapacitorSemiconductor Device FabricationFermi-level UnpinningAln Passivation LayerMolecular Beam EpitaxyHigh-k Insulator LayerMicroelectronicsOptoelectronicsCategoryiii-v SemiconductorCompound Semiconductor
This paper examines the utilization of plasma-enhanced atomic layer deposition grown AlN in the fabrication of a high-k insulator layer on GaAs. It is shown that high-k GaAs MIS capacitors with an unpinned Fermi level can be fabricated utilizing a thin ex-situ deposited AlN passivation layer. The illumination and temperature induced changes in the inversion side capacitance, and the maximum band bending of 1.2 eV indicates that the MIS capacitor reaches inversion. Removal of surface oxide is not required in contrast to many common ex-situ approaches.
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