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Elimination of trench defects and V-pits from InGaN/GaN structures
47
Citations
11
References
2015
Year
SemiconductorsWide-bandgap SemiconductorElectrical EngineeringSemiconductor TechnologyEngineeringGrowth TemperaturePhysicsCrystalline DefectsTrench DefectsGan Quantum BarriersApplied PhysicsQuantum MaterialsGan QbsAluminum Gallium NitrideGan Power DeviceMicroelectronicsCategoryiii-v Semiconductor
The microstructural evolution of InGaN/GaN multiple quantum wells grown by metalorganic chemical vapor phase epitaxy was studied as a function of the growth temperature of the GaN quantum barriers (QBs). We observed the formation of basal stacking faults (BSFs) in GaN QBs grown at low temperature. The presence of BSFs terminated by stacking mismatch boundaries (SMBs) leads to the opening of the structure at the surface into a V-shaped trench loop. This trench may form above an SMB, thereby terminating the BSF, or above a junction between the SMB and a subsequent BSF. Fewer BSFs and thus fewer trench defects were observed in GaN QBs grown at temperatures higher than 830 °C. Further increase in the growth temperature of the GaN QBs led to the suppression of the threading dislocation opening into V-pits.
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