Publication | Closed Access
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders
47
Citations
20
References
2005
Year
Materials ScienceMaterials EngineeringEutectic Sn37pbEngineeringMechanical EngineeringHot WorkingElectronic PackagingSn3.5ag SoldersThermomechanical ProcessingMechanics Of MaterialsMicrostructure
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