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Dependence of copper interconnect electromigration phenomenon on barrier metal materials
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2003
Year
Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineeringNanoelectronicsApplied PhysicsBarrier Metal MaterialsMetallurgical InteractionElectronic PackagingMicroelectronicsElectrochemical InterfaceInterconnect (Integrated Circuits)Electrical Insulation
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