Coupling monolayers for protection of microelectronic circuits

Abstract

Abstract Two polymeric coatings, a silicone gel (Dow Corning 6646) and an epoxy resin (Dexter FP 4402), were glob‐top coated onto representative microelectronic circuits, AT&T Triple Track Testers (TTTs), and subjected to the Pressure Cooker Test (PCT). Coupling monolayers were self‐ assembled on the TTTs prior to encapsulation to improve the moisture protection capabilities of the coatings. Leakage current measurements were made to evaluate the effect of applied monolayers on the moisture protection capability. The moisture protection capability was assessed in short‐term and long‐term leakage current measurements. MHDA (16‐mercaptohexadecanoic acid) and APS (gamma‐aminopropyltriethoxysilane) monolayers, in combination with silicone gel and epoxy resin respectively, exhibited very good moisture protection performance.