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Probing the properties of atomic layer deposited ZrO2 films on p-Germanium substrates
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Citations
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References
2012
Year
Zirconium OxideEngineeringThin Film Process TechnologyAtomic LayerZro2 FilmsSemiconductorsIi-vi SemiconductorNanoelectronicsP-germanium SubstratesMolecular Beam EpitaxyEpitaxial GrowthAtomic Layer DepositionMaterials ScienceOxide HeterostructuresElectrical EngineeringOxide ElectronicsOxide SemiconductorsSemiconductor MaterialMicroelectronicsElectrical PropertySurface ScienceApplied PhysicsThin FilmsChemical Vapor Deposition
Zirconium oxide (ZrO2) thin films of 5 and 25 nm thickness were deposited by atomic layer deposition at 250 °C on p-type Ge substrates. The stoichiometry, thickness, and valence band electronic structure of the ZrO2 films were investigated by x-ray and ultraviolet photoelectron spectroscopies. For the electrical characterization, metal-oxide-semiconductor (MOS) capacitive structures (Pt/ZrO2/p-Ge) have been fabricated. Capacitance–voltage and conductance–voltage (C–V, G–V) measurements performed by ac impedance spectroscopy in the temperature range from 153 to 313 K reveal a typical MOS behaviour with moderate frequency dispersion at the accumulation region attributed to leakage currents. For the determination of the leakage currents conduction mechanisms, current density–voltage (J–V) measurements were carried out in the whole temperature range.
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