Applied Physics Letters · 1988 · 78 citations · 6 references
EngineeringElectrical EngineeringMaterials ScienceHeat TransferMicrofabricationSemiconductor DevicesCooling SystemsDevice ScalingHeat ExchangersLaser CoolingThermal ManagementThermal Properties Of SemiconductorsEdge-emitting Laser DiodesHeat Exchanger DesignMicrochannel CoolingMicrochannel DesignMicrochannel Heat ExchangersSemiconductor Laser DiodesSilicon MicrochannelsSilicon Microstructures
A heat exchanger package has been demonstrated for semiconductor laser arrays using silicon microstructures with water as the coolant. A thermal impedance of 0.04 °C cm2/W has been achieved for a single linear bar. This design makes use of efficient, edge-emitting laser diode arrays in a rack and stack architecture combined with a high-performance silicon microchannel structure to allow cw operation. The architecture can be scaled to large areas and we project a thermal impedance of 0.09 °C cm2/W for close-packed two-dimensional arrays on this device.
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High-power conversion efficiency quantum well diode lasers
R. G. Waters, David K. Wagner, D. S. Hill et al. · Applied Physics Letters · 1987 · 23 citations