Interplay between the deposition mode and microstructure in electrochemically deposited Cu thin films - Concepedia

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Interplay between the deposition mode and microstructure in electrochemically deposited Cu thin films

21

Citations

24

References

2007

Year

K. Kremmer, Olga Yezerska, Gerhard Schreiber, M. Masimov, V. Klemm, M. Schneider, David Rafaja

Thin Solid Films

Materials ScienceEngineeringApplied PhysicsDeposition ModeThin FilmsChemical DepositionCu Thin FilmsChemical Vapor DepositionThin Film ProcessingElectrochemistry

References

	Year	Citations

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