Publication | Closed Access
The effect of thermal treatment on the electrical activity and mobility of dislocations in Si
42
Citations
15
References
1980
Year
EngineeringDislocation VelocitySevere Plastic DeformationMechanical EngineeringSilicon On InsulatorImpurity AtmospheresElectrical ActivityDislocation GlideMechanicsMicrostructure-strength RelationshipElectronic PackagingMaterials EngineeringMaterials ScienceElectrical EngineeringThermal TreatmentMechanical BehaviorSolid MechanicsSemiconductor Device FabricationDefect FormationMechanical DeformationMicrostructureSilicon DebuggingDislocation InteractionApplied PhysicsThermal EngineeringMechanics Of MaterialsElectrical Insulation
It is shown that the starting stresses for dislocation glide and their electrical activity are determined by the temperature, dislocation velocity, and distance moved upon bringing them to the starting position and, also, on the sample cooling rate after deformation. A correlation between starting is stresses and dislocation donor center concentration is observed. It is shown that the result obtained is determined by the formation of complicated centers in the impurity atmospheres of both, mobile and immobile dislocations. [Russian Text Ignored].
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