Journal of The Electrochemical Society · 2006 · 51 citations · 39 references
Natural SciencesChemistryMaterials ScienceElectrochemistrySurface ChemistrySurface ScienceElectrode MaterialsElectrode-electrolyte InterfacesMetal SulfidesRaman SpectroscopySurface PhysicsWorking ElectrodesElectrodepositionIn Situ Raman SpectroscopyInterfacial Chemistry Of Metal SulfidesMetal Sulfide ElectrodesRaman SpectraSurface Chemistry Of Metal SulfidesSurface-enhanced Raman ScatteringSurface-enhanced Raman Spectroscopy
This paper reports an in situ Raman study of Cu electrodeposition from an acidic sulfate solution in the presence of bis-(3-sulfopropyl)-disulfide Na salt (SPS). In the absence of chloride, in situ surface-enhanced Raman spectra scarcely show few labile features in a narrow range of cathodic potential. When ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.
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