Publication | Closed Access
A study of large area die bonding materials and their corresponding mechanical and thermal properties
28
Citations
8
References
2011
Year
Materials EngineeringMaterials ScienceEngineeringMechanical PropertiesMaterial PropertyMechanical EngineeringApplied PhysicsMaterial ModelingSolid MechanicsMicrostructure-strength RelationshipHigh-performance MaterialMaterial PerformanceElectronic PackagingMechanics Of MaterialsMicrostructureThermal Properties
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