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Preparation of Large Freestanding GaN Substrates by Hydride Vapor Phase Epitaxy Using GaAs as a Starting Substrate
311
Citations
17
References
2001
Year
Materials ScienceWide-bandgap SemiconductorElectrical EngineeringThick Gan LayerGan SubstrateEngineeringCrystalline DefectsSemiconductor TechnologySurface ScienceApplied PhysicsAluminum Gallium NitrideFreestanding Gan SubstrateGan Power DeviceCategoryiii-v SemiconductorStarting SubstrateCompound Semiconductor
A freestanding GaN substrate over 2 inches in size was successfully prepared for the first time by hydride vapor phase epitaxy (HVPE) using GaAs as a starting substrate. In the experiment, a GaAs (111)A substrate with a SiO 2 mask pattern on its surface was used. A thick GaN layer was grown on the GaAs substrate at 1030°C through the openings in the SiO 2 mask. By dissolving the GaAs substrate in aqua regia, a freestanding GaN substrate about 500 µm thick was obtained. The full-width at half maximum (FWHM) in the ω-mode X-ray diffraction (XRD) profile of GaN (0002) plane was 106 arcsec. The dislocation density of the GaN substrate obtained was determined to be as low as 2×10 5 cm -2 by plan-view transmission electron microscopy (TEM). Hall measurements revealed the n-type conductivity of the GaN substrate with typical carrier concentration and carrier mobility of 5×10 18 cm -3 and 170 cm 2 ·V -1 ·s -1 , respectively.
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