Laser ablation of organic polymers: Microscopic models for photochemical and thermal processes

Barbara J. Garrison, R. Srinivasan

Journal of Applied Physics · 1985 · 230 citations · 16 references

Concepts

TL;DR

Short‑pulse far‑UV (193 nm) and longer‑wavelength (532 nm) laser irradiation both ablate organic polymers, but via distinct mechanisms. The study develops microscopic models for the photochemical and thermal ablation processes. The photochemical model predicts well‑defined pits with narrow angular ejection and 1000–2000 m/s perpendicular velocity, whereas the thermal model predicts melting or distortion and a broad angular distribution. Experimentally, far‑UV ablation produces clean, well‑defined pits, while 532 nm ablation results in distorted, melted material around the pit.

Abstract

Irradiation of organic polymers by short pulses of far-UV (e.g., 193 nm) laser light causes ablative photodecomposition (APD) of the material. This etching process occurs cleanly leaving behind a well-defined pit. Longer wavelength (e.g., 532 nm) laser light also ablates material from a polymeric solid. However, this process is distinct from APD in that the sample near the pit is distorted and melted. Microscopic models are presented here for both the photochemical and thermal processes. The photochemical model predicts that well-defined pits will be formed, that narrow angular distributions of the ablated material should be observed, and that the average perpendicular ejection velocity will be 1000–2000 m/s. The thermal model predicts melting or distortion of the solid and a broad angular distribution of the ejected material.

References

16