Fundamental Conceptions Modeling the Thickness Distribution of Low Pressure Chemically Vapor Deposited Films on Wafers and within Narrow Trenches

Abstract

A comparative analysis of different models describing the thickness uniformity of LPCVD films on wafers and within trenches is given, For a systematic classification of known experimental findings it is necessary to complete the two types of basic models well‐established in the literature by a third one, the so‐called "by‐product model." This model is able to explain the phenomenon of the "deposition rate jump" at top edges of a trench.