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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

Materials ScienceMaterials EngineeringFriction WeldingEngineeringIntermetallic LayersCorrosionApplied PhysicsMetallurgical InteractionCladding (Metalworking)Weld Pool SolidificationElectronic PackagingSn-ag-cu Solder JointsMicrostructureMetal Processing