Publication | Closed Access
Sputtering and Redeposition of Cathode Material during Plasma Nitriding
19
Citations
3
References
1986
Year
Plasma NitridingEngineeringGlow DischargePlasma PhysicsPlasma ProcessingPlasma ElectronicsMagnetohydrodynamicsPlasma ConfinementMaterials ScienceMaterials EngineeringPhysicsPlasma-material InteractionsMicrostructureSurface AreaSurface ScienceApplied PhysicsRelative Surface AreaGas Discharge PlasmaPlasma Application
Copper, titanium and iron-manganese-aluminium alloy workpieces have been exposed to a plasma nitriding glow discharge at 450°C. It has been found that material is non-uniformly sputtered and redeposited on the cathode in the form of a surface layer. The relative surface area covered by redeposited material with respect to the surface area on which sputtering predominates is governed by workpiece geometry and operating pressure.
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