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Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies

Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationApplied PhysicsAlloy DesignMetallurgical InteractionHot WorkingCu/snagcu/ni Joint AssembliesMechanics Of MaterialsMicrostructureSolder Alloy Hardening