Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler - Concepedia

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Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

37

Citations

4

References

2003

Year

Shih‐Ying Chang, L.C. Tsao, Meng‐Ju Chiang, Chien‐Yueh Tung, Guan-Hong Pan, Tung‐Han Chuang

Journal of Materials Engineering and Performance

Materials EngineeringMaterials ScienceEngineeringPowder MetallurgySurface ScienceApplied PhysicsMetallurgical ProcessIndium Tin OxideElectronic PackagingActive SolderingSurface ProcessingMaterial Preparation

References

	Year	Citations

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