Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish - Concepedia

Concepedia

Publication | Closed Access

Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

49

Citations

29

References

2011

Year

Jik Chang Leong, L.C. Tsao, Chaojun Fang, Chien-Hsun Chu

Journal of Materials Science Materials in Electronics

Materials EngineeringNano-tio2 AdditionMaterials ScienceEngineeringApplied PhysicsElectronic PackagingMaterial Preparation

References

	Year	Citations

Page 1