Finite element analysis and simulation of adhesive bonding, soldering and brazing: A bibliography (1976 - 1996)

Abstract

This paper gives a bibliographical review of the finite element methods (FEMs) applied to the analysis and simulation of adhesive bonding, soldering and brazing processes. The bibliography at the end of the paper contains references to papers, conference proceedings and theses/dissertations on the subjects that were published in 1976 - 1996. The following topics are included: adhesive bonding - stress analysis of adhesive bonding in general, stress analysis and design of specific bonded joints, fracture mechanics and fatigue analysis, destructive and nondestructive evaluation of bonds, other topics; soldering - thermal stresses and deformation analysis of solder joints, fracture mechanics aspects and fatigue analysis of solder joints, solder joint reliability; and brazing - finite element analysis and simulation.