Publication | Closed Access
Electromigration Performance of Multi-level Damascene Copper Interconnects
54
Citations
0
References
2001
Year
Electrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsElectromigration PerformanceElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)
No additional data available for this publication yet. Check back later!