Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive

Abstract

Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resulting from variation of the feature's aspect ratio, bulk composition, and level of additive components was investigated. The operating window of bath conditions for void-free electrodeposition was studied in the range of to bulk concentration of additive in a 0.25 M plating solution and for aspect ratios (depth:width) from 0.5 to 4. The mathematical model includes fluid flow, transport by diffusion, migration and convection, multiple species, and reactions in complex geometries. © 2000 The Electrochemical Society. All rights reserved.