Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Tin–lead (SnPb) solder reaction in flip chip technology

K. N. Tu, Ke Zeng · Materials Science and Engineering R Reports · 2001 · 589 citations

Engineering, Materials Engineering, Materials Science +10

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 587 citations

Natural Sciences, Materials Engineering, Materials Science +10

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements

Dingfeng Yu, Jie Zhao, Li Wang · Journal of Alloys and Compounds · 2004 · 226 citations

Engineering, Materials Engineering, Materials Science +12