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Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application

Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationApplied PhysicsGlass-to-glass Electrostatic BondingVacuum PackagingSemiconductor Device FabricationVacuum DeviceElectronic PackagingSilicon On InsulatorMicroelectronicsElectrical Insulation