Integrated hybrid silicon triplexer

Abstract

We demonstrate an integrated triplexer on silicon with a compact size of 1mm by 3.5mm by utilizing a selective area wafer bonding technique. The wavelength demultiplexer on the triplexer chip successfully separates signals at wavelengths of 1310 nm, 1490 nm and 1550 nm with more than 10 dB extinction ratio. The measured 3 dB bandwidth of the integrated laser and photodetectors are 2 GHz and 16 GHz, respectively. Open eye diagrams are also measured for the integrated photodetector up to 12.5 GHz PRBS inputs.