Publication | Open Access
High surface passivation quality and thermal stability of ALD Al2O3 on wet chemical grown ultra-thin SiO2 on silicon
39
Citations
6
References
2011
Year
Aluminium NitrideEngineeringUltra-thin Sio2Silicon On InsulatorH-terminated SiSemiconductorsSurface TechnologyChemical EngineeringAld Al2o3NanoelectronicsAl2o3 Thin FilmsThermal StabilityMaterials ScienceCrystalline DefectsOxide ElectronicsSurface PassivationSemiconductor Device FabricationMicroelectronicsSurface CharacterizationSurface ScienceApplied PhysicsSurface EngineeringThin FilmsChemical Vapor Deposition
In this work we present the surface passivation properties of pre-oxidized Si(100) surfaces compared to H-terminated Si(100) after atomic layer deposition (ALD) of Al2O3 thin films. Additionally the differences in surface passivation for n- and p-type silicon were investigated. The pre-oxidation was carried out in three different wet chemical solutions: (a) nitric acid (HNO3), (b) hydrochloric acid mixed with hydrogen peroxide (HCl/H2O2) and (c) a sulphuric acid with hydrogen peroxide (H2SO4/H2O2). The surface passivation quality was determined directly after deposition, after anneal at 400 °C in N2 atmosphere for 10 min and after direct firing at 850 °C in ambient for several seconds. Directly after deposition we find significantly higher passivation quality for the Al2O3 passivated samples with pre-oxidized surfaces than for H-terminated surfaces. After anneal and after directly firing the passivation quality for Al2O3 on H-terminated surfaces is slightly better, nevertheless the surface recombination velocity for Al2O3 on pre-oxidized silicon surfaces is still < 15 cm/s for n-type Fz silicon and < 70 cm/s for p-type Cz. A high quality surface passivation can therefore be achieved for silicon pre-oxidized with wet chemistries. The field-effect passivation for HF-last ALD Al2O3 exceeds the level of pre-oxidized samples after anneal as well as after direct firing.
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