Proceedings of the IEEE · 1967 · 27 citations · 5 references
EngineeringElectrical EngineeringMaterials ScienceHeat TransferSemiconductor DevicesSemiconductor MaterialsHeat ConductionHeat Transfer AnalysisHeat Transfer ModelingSemiconductor PhysicsThermal Properties Of MaterialsThermal Properties Of SemiconductorsElectrothermal SimulationHigh-temperature Thermal PropertiesTemperature DependenceTemperature Dependence Of Thermal ConductivityTemperature Distribution AnalysisTemperature Distribution ModelingThermal Management Of Semiconductor DevicesThermal Resistivity
The temperature distribution has been computed for n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">++</sup> -n-n <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">+</sup> sandwich structures mounted on an infinite half plane of copper. It is found necessary to include the temperature dependence of the thermal conductivities of the semiconductor layers in the calculation.
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Recent results with epitaxial GaAs Gunn effect oscillators
D.P. Brady, Stephen Knight, K. L. Lawley et al. · Proceedings of the IEEE · 1966 · 32 citations
Current runaway in n-GaAs bulk effect devices
Stephen Knight · Proceedings of the IEEE · 1966 · 10 citations