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Thermal and Mechanical Stability of Ce-Containing Sn-3.9Ag-0.7Cu Lead-Free Solder on Cu and Electroless Ni-P Metallizations

Materials ScienceMaterials EngineeringEngineeringMetallurgical SystemCorrosionMechanical StabilityMechanical EngineeringMetallurgical InteractionMetallurgical ProcessElectronic PackagingElectroless Ni-p MetallizationsCermetMicrostructure