Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate - Concepedia

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Effect of the soldering time on the formation of interfacial structure between Sn–Ag–Zn lead-free solder and Cu substrate

15

Citations

33

References

2007

Year

Jing Wan, Yong Chang Liu, Wei Chen, Peng Jiang, Zhi Ming Gao

Journal of Materials Science Materials in Electronics

Materials EngineeringMaterials ScienceEngineeringInterfacial StructureApplied PhysicsSn–ag–zn Lead-free SolderMetallurgical InteractionElectronic PackagingSoldering TimeMicrostructureMetal Processing

References

	Year	Citations

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