Nanotechnology · 2005 · 129 citations · 7 references
Natural SciencesMaterials EngineeringMaterials ScienceSurface EngineeringSurface ScienceThin FilmsCoating ProcessesCoating TechnologyCoatingsNanoimprint LithographySurface CoatingsThin-film DepositionCo-evaporationCoating CharacterizationProcess ParametersProcess Parameters OptimizationSilane CoatingSilane CouplingSubstrate AdhesionWater Contact Angle
A new chemical vapour deposition setup for the generation of anti-adhesive coatings on Si stamps used in nanoimprint lithography has been developed. This is suitable for controlled co-evaporation of more than one type of silane by directly injecting a premixed silane into an evacuated deposition reactor through a septum. This process was found to be very flexible and resulted in reproducible coatings. A surface coated with a mixture of mono- and trichlorosilanes shows a higher water contact angle than those of individual coatings, which is attributed to the interaction between the two types of silane molecules. In addition, the influence of process parameters, e.g. water content, temperature and number of imprints, on the coating quality will be discussed.
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Improving stamps for 10 nm level wafer scale nanoimprint lithography
M. Beck, Mariusz Graczyk, Ivan Maximov et al. · Microelectronic Engineering · 2002 · 268 citations
Quantitative analysis of the molding of nanostructures
Helmut Schift, Christian Dávid, J. Gobrecht et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2000 · 49 citations · Full text
Engineering, Manufacturing Engineering, Materials Science +14
Chemical nano-patterning using hot embossing lithography
Helmut Schift, Laura J. Heyderman, Celestino Padeste et al. · Microelectronic Engineering · 2002 · 42 citations