High-precision drop shape analysis (HPDSA) of quasistatic contact angles on silanized silicon wafers with different surface topographies during inclining-plate measurements: Influence of the surface roughness on the contact line dynamics

Publication | Closed Access

DOI

Citations

References

2015

Year

Florian Heib, Rolf Hempelmann, Walid‐Madhat Munief, Sven Ingebrandt, Frank Fug, Wulff Possart, Katja Groß, Michael Schmitt

Applied Surface Science

Silanized Silicon WafersWafer Scale ProcessingEngineeringMicrofabricationMechanicsContact MechanicMechanical EngineeringSurface ScienceApplied PhysicsContact Line DynamicsSemiconductor Device FabricationElectronic PackagingSilicon On InsulatorMicroelectronicsQuasistatic Contact Angles