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Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate

Materials ScienceInterfacial ReactionsMaterials EngineeringEngineeringMechanical PropertiesMetallurgical InteractionSn–4.0ag–0.5cu–0.05ni–0.01ge Lead-free SoldersChemistryMetallurgical System