Publication | Closed Access
Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
101
Citations
20
References
2004
Year
Materials ScienceMaterials EngineeringInterfacial ReactionsEngineeringImpact ReliabilityMechanical EngineeringMetallurgical InteractionChip AttachmentElectronic PackagingSn–zn Solder Joints
| Year | Citations | |
|---|---|---|
Page 1
Page 1