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Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters

Materials ScienceWafer Scale ProcessingEngineeringProcess ParametersAdvanced Packaging (Semiconductors)Mechanical EngineeringFinite-element AnalysisStressstrain AnalysisSolid MechanicsResidual StressElectronic PackagingMicroelectronicsMechanics Of MaterialsInterconnect (Integrated Circuits)