Preparation and Properties of Cu Matrix Reinforced with Ti<sub>2</sub>AlN Ceramic Particles

Abstract

Cu matrix composites with various contents of Ti 2 AlN were fabricated by powder metallurgy using spark plasma sintering (SPS) method. Ti 2 AlN ceramic particles were pre-treated by electroless copper plating, the result showed that Ti 2 AlN reinforcement and Cu matrix were strongly bonded. The effects of Ti 2 AlN content on microstructure, electrical resistivity and mechanical properties were systematically investigated. With the addition of low fraction of Ti 2 AlN, the hardness and tensile strength of matrix were improved without losing the fracture toughness too much. Tensile strength of Ti 2 AlN/Cu composites were about 380 MPa with the content of 7 wt. % reinforcing phase, and the conductivity of the composites remained about 61.5 % IACS. Moreover, the wear tests illustrated that the loads were effectively born by the Ti 2 AlN reinforcement, the main tribological mechanism changed from adhesive wear to abrasive wear compared with Cu, thus the friction and wear resistance was also obviously improved.