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Electrical properties of Ta2O5 films obtained by plasma enhanced chemical vapor deposition using a TaF5 source
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1996
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EngineeringReversible Electron TrappingThin Film Process TechnologyChemical DepositionElectrical PropertiesTaf5 SourceNm Sio2 EquivalentLow PressureThin Film ProcessingMaterials ScienceMaterials EngineeringElectrical EngineeringPhysicsTa2o5 FilmsOxide ElectronicsMaterial AnalysisElectronic MaterialsSurface ScienceApplied PhysicsThin FilmsChemical Vapor Deposition
High quality Ta2O5 thin films have been obtained from TaF5 and O2 using a microwave excited electron cyclotron resonance plasma at low pressure (∼2 mTorr). Physical and electrical measurements reveal that the as-deposited amorphous films have excellent properties: refractive indices ∼2.16, dielectric constants ∼25, and leakage currents <10−10 A cm−2 at 2.5 V (0.3 MV cm−1, 85 nm thick, 13 nm SiO2 equivalent). Trapping and conduction properties of these layers have also been investigated, showing a reversible electron trapping and a trap-limited Poole–Frenkel effect.