Publication | Closed Access
Thermal Shock Behavior of Isotropic and Anisotropic Porous Silicon Nitride
64
Citations
19
References
2003
Year
Porous Si 3N 4EngineeringNanoporous MaterialMechanical EngineeringSilicon On InsulatorPorous BodyMechanics ModelingMaterials ScienceThermal TransportThermal Shock BehaviorSolid MechanicsMicrostructurePorothermoelasticityMechanical PropertiesSurface ScienceApplied PhysicsPorosityCrack FormationMechanics Of Materials
The thermal shock behavior of isotropic and anisotropic porous Si 3 N 4 was evaluated using the water‐quenching technique. The critical temperature difference for crack initiation was found to be strongly dependent on the ratio of fracture strength to elastic modulus. Because of a very high strain‐to‐failure, anisotropic porous Si 3 N 4 showed no macroscopic cracks and was able to retain its strength even at a quenching‐temperature difference of ∼1400°C.
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