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FIB-based technique for stress characterization on thin films for reliability purposes

Materials ScienceEngineeringDevice ReliabilityApplied PhysicsStressstrain AnalysisSolid MechanicsResidual StressHigh Strain RateStress CharacterizationThin FilmsElectronic PackagingFib-based TechniqueMechanics Of MaterialsPhysic Of FailureElectrical Insulation